Method for forming source/drain contacts utilizing an inhibitor

ABSTRACT

A method includes providing a structure having a substrate, a gate, a gate spacer, a dielectric gate cap, a source/drain (S/D) feature, a contact etch stop layer (CESL) covering a sidewall of the gate spacer and a top surface of the S/D feature, and an inter-level dielectric (ILD) layer. The method includes etching a contact hole through the ILD layer and through a portion of the CESL, the contact hole exposing the CESL covering the sidewalls of the gate spacer and exposing a top portion of the S/D feature. The method includes forming a silicide feature on the S/D feature and selectively depositing an inhibitor on the silicide feature. The inhibitor is not deposited on surfaces of the CESL other than at a corner area where the CESL and the silicide feature meet.

PRIORITY

The present application claims the benefits of and priority to U.S.Provisional Application No. 62/982,437, entitled “Method for FormingSource/Drain Contacts” and filed Feb. 27, 2020, herein incorporated byreference in its entirety.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experiencedexponential growth. Technological advances in IC materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generation. In the course of ICevolution, functional density (i.e., the number of interconnecteddevices per chip area) has generally increased while geometry size(i.e., the smallest component (or line) that can be created using afabrication process) has decreased. This scaling down process generallyprovides benefits by increasing production efficiency and loweringassociated costs. Such scaling down has also increased the complexity ofprocessing and manufacturing ICs and, for these advancements to berealized, similar developments in IC processing and manufacturing areneeded.

For example, when the scaling down continues beyond 32 nm or smaller,increased source/drain (S/D) contact resistance becomes a concern inoverall transistor resistance. Further, isolation among nearby S/Dcontacts also become more important. Methods and structures for reducingS/D contact resistance and increasing isolation among nearby S/Dcontacts are highly desired.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIGS. 1A and 1B shows a flow chart of a method of forming asemiconductor device according to embodiments of the present disclosure.

FIG. 2A shows a schematic top view of a semiconductor device (orstructure), in portion, according to embodiments of the presentdisclosure; FIG. 2B shows a perspective view of a portion of thesemiconductor device of FIG. 2A according to embodiments of the presentdisclosure; FIG. 2C shows a cross-sectional view of a portion of thesemiconductor device of FIG. 2A along the A-A line of FIGS. 2A and 2B,according to embodiments of the present disclosure; and FIG. 2D shows across-sectional view of a portion of the semiconductor device of FIG. 2Aalong the B-B line of FIGS. 2A and 2B, according to embodiments of thepresent disclosure.

FIGS. 3A, 4A, 5A, 6A, 7A, 8A, 9A, 10A, and 11A are cross-sectional viewsof a portion of a semiconductor device along the A-A line of FIGS. 2Aand 2B during various manufacturing stages according to the method inFIGS. 1A and 1B in accordance with embodiments of the presentdisclosure.

FIGS. 3B, 4B, 5B, 6B, 7B, 8B, 9B, 10B, and 11B are cross-sectional viewsof a portion of a semiconductor device along the B-B line of FIGS. 2Aand 2B during various manufacturing stages according to the method inFIGS. 1A and 1B in accordance with embodiments of the presentdisclosure.

FIGS. 12 and 13 illustrate cross-sectional views of a portion of asemiconductor device along the A-A line of FIGS. 2A and 2B duringvarious manufacturing stages according to the method in FIGS. 1A and 1Bin accordance with an alternative embodiment of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly. Still further, when anumber or a range of numbers is described with “about,” “approximate,”and the like, the term is intended to encompass numbers that are withina reasonable range including the number described, such as within +/−10%of the number described or other values as understood by person skilledin the art. For example, the term “about 5 nm” encompasses the dimensionrange from 4.5 nm to 5.5 nm.

The present disclosure is generally related to a semiconductor deviceand its manufacturing method, and more particularly to source/draincontacts and formation methods thereof. An object of the presentdisclosure is to enlarge source/drain (S/D) contact areas (thus reducingS/D contact resistance) while keeping good isolation between differentS/D contacts as well as between S/D contacts and gates. Another objectof the present disclosure is to improve process robustness. To achievethese objects, a process according to the present disclosure includesdepositing an inhibitor selectively on S/D silicidation exposed in S/Dcontact holes. The inhibitor includes an organic film, such as a filmhaving amphiphilic molecules, which inhibits the deposition of adielectric material thereon. Subsequently, the process forms a S/Ddielectric liner layer (or a dielectric liner) on sidewalls of the S/Dcontact holes. Due to the property of the inhibitor, the dielectricliner layer is free from the top surface of the inhibitor, other than anedge area of the inhibitor. Thus, a vertical etching of the dielectricliner layer is avoided, which generally improves the process'srobustness. The process flow further includes removing the inhibitor,which reveals greater surfaces of the silicidation for increased S/Dcontact area. The process flow further includes depositing one or moremetals into the contact holes, and planarizing the one or more metals toform source/drain contacts.

The present disclosure provides one or more of the following advantages.First, it does not require vertical etching of the source/drain linerlayer and the etching of the gate. Advantageously, the initial gate canbe made shorter to improve the robustness of the overall process.Second, the interfacial area between the source/drain contacts and thesilicide increases, thereby reducing source/drain contact resistanceThese and other aspects of the present disclosure will be furtherdiscussed with reference to FIGS. 1A-13.

FIGS. 1A and 1B show a flow chart of a method 10 of forming asemiconductor device 100 (or a semiconductor structure 100), accordingto various aspects of the present disclosure. A top view, a perspectiveview, and two cross-sectional views of the semiconductor device 100 at afabrication stage are illustrated in FIGS. 2A, 2B, 2C, and 2Drespectively. The method 10 is merely an example, and is not intended tolimit the present disclosure beyond what is explicitly recited in theclaims. Additional operations can be provided before, during, and afterthe method 10, and some operations described can be replaced,eliminated, or relocated for additional embodiments of the method.Method 10 is described below in conjunction with FIGS. 2A-13 whichillustrate portions of the semiconductor device 100 in various stages ofa manufacturing process. Particularly, FIGS. 2C, 3A, 4A, 5A, 6A, 7A, 8A,9A, 10A, 11A, 12, and 13 are cross-sectional views of a portion of thedevice 100 along a fin length direction “A-A” of FIGS. 2A and 2B; andFIGS. 2D, 3B, 4B, 5B, 6B, 7B, 8B, 9B, 10B, and 11B are cross-sectionalviews of the portion of the device 100 along a fin width direction “B-B”of FIGS. 2A and 2B. The semiconductor device 100 is provided forillustration purposes and does not necessarily limit the embodiments ofthe present disclosure to any number of devices, any number of regions,or any configuration of structures or regions. Furthermore, thesemiconductor device 100 may be an intermediate device fabricated duringprocessing of an IC, or a portion thereof, that may comprise staticrandom access memory (SRAM) and/or logic circuits, passive componentssuch as resistors, capacitors, and inductors, and active components suchas p-type field effect transistors (PFETs), n-type FETs (NFETs),multi-gate FETs such as FinFETs and gate-all-around devices, metal-oxidesemiconductor field effect transistors (MOSFETs), complementarymetal-oxide semiconductor (CMOS) transistors, bipolar transistors, highvoltage transistors, high frequency transistors, other memory cells, andcombinations thereof.

At operation 12, the method 10 (FIG. 1A) provides a structure of thedevice 100, an embodiment of which is shown in FIGS. 2A, 2B, 2C, and 2D.Particularly, FIG. 2A shows a schematic top view of a portion of thedevice 100, FIG. 2B shows a perspective view of a portion of the device100; FIG. 2C shows a cross-sectional view of a portion of the device 100along the A-A line of FIGS. 2A and 2B, and FIG. 2D shows across-sectional view of a portion of the device 100 along the B-B lineof FIGS. 2A and 2B, according to embodiments of the present disclosure.Referring to FIG. 2A, the device 100 includes active regions (such assemiconductor fins) 103 oriented lengthwise along the “x” direction andgate stacks (or gate structures) 106 oriented lengthwise along the “y”direction that is generally perpendicular to the “x” direction. The gatestacks 106 engage the channel regions of the active regions 103 to formtransistors therein, which may be FinFET or other types of multi-gatedevices such as gate-all-around devices. FIG. 2B illustrates a portion101 of the device 100 in an embodiment where the active regions 103 aresemiconductor fins. Hereinafter the active regions 103 are also referredto as semiconductor fins 103 or fins 103.

Referring to FIGS. 2A-2D collectively, the device 100 includes asubstrate 102, over which the fins 103 and the gate stacks 106 areformed. The device 100 includes an isolation structure 105 for isolatingthe fins 103. The fins 103 extend from the substrate 102 and above theisolation structure 105. The gate stacks 106 are disposed above theisolation structure 105 and on three sides of every fin 103. The device100 further includes S/D features 104 over the fins 103 and on bothsides of the gate stacks 106. The device 100 further includes gatespacers 108 on sidewalls of the gate stacks 106, fin sidewall spacers107 on sidewalls of the fins 103, a contact etch stop layer (CESL) 110over the gate spacers 108 and the S/D features 104, a dielectric gatecap 109 disposed on the gate stacks 106 (and optionally on the gatespacers 108 and/or the CESL 110), and a dielectric layer 112 over thedielectric gate cap 109 and the CESL 110 and filling in the gaps betweenthe adjacent gate stacks 106. The various features (or components) ofthe device 100 are further described below.

The substrate 102 is a silicon (Si) substrate in the present embodiment,such as a silicon wafer. In alternative embodiments, the substrate 102includes other elementary semiconductors such as germanium (Ge); acompound semiconductor such as silicon carbide (SiC), gallium arsenide(GaAs), indium arsenide (InAs), and indium phosphide (InP); or an alloysemiconductor, such as silicon germanium (SiGe), silicon germaniumcarbide (SiGeC), gallium arsenic phosphide (GaAsP), and gallium indiumphosphide (GaInP). In embodiments, the substrate 102 may include siliconon insulator (SOI) substrate, be strained and/or stressed forperformance enhancement, include epitaxial regions, doped regions,and/or include other suitable features and layers.

The fins 103 may include one or more layers of semiconductor materialssuch as silicon or silicon germanium. The fins 103 may be patterned byany suitable method. For example, the fins 103 may be patterned usingone or more photolithography processes, including double-patterning ormulti-patterning processes. Generally, double-patterning ormulti-patterning processes combine photolithography and self-alignedprocesses, allowing patterns to be created that have, for example,pitches smaller than what is otherwise obtainable using a single, directphotolithography process. For example, in one embodiment, a sacrificiallayer is formed over a substrate and patterned using a photolithographyprocess. Spacers are formed alongside the patterned sacrificial layerusing a self-aligned process. The sacrificial layer is then removed, andthe remaining spacers, or mandrels, may then be used as a maskingelement for patterning the fins 103. For example, the masking elementmay be used for etching recesses into semiconductor layers over or inthe substrate 102, leaving the fins 103 on the substrate 102. Theetching process may include dry etching, wet etching, reactive ionetching (RIE), and/or other suitable processes. For example, a dryetching process may implement an oxygen-containing gas, afluorine-containing gas (e.g., CF₄, SF₆, CH₂F₂, CHF₃, and/or C₂F₆), achlorine-containing gas (e.g., Cl₂, CHCl₃, CCl₄, and/or BCl₃), abromine-containing gas (e.g., HBr and/or CHBR₃), an iodine-containinggas, other suitable gases and/or plasmas, and/or combinations thereof.For example, a wet etching process may comprise etching in dilutedhydrofluoric acid (DHF); potassium hydroxide (KOH) solution; ammonia; asolution containing hydrofluoric acid (HF), nitric acid (HNO₃), and/oracetic acid (CH₃COOH); or other suitable wet etchant. Numerous otherembodiments of methods to form the fins 103 may be suitable. In someembodiment where the device 100 includes gate-all-around transistors,the fins 103 include multiple layers of semiconductor materials that arevertically stacked (along the “z” direction) and horizontally (along the“x” direction) connecting the S/D features 104 on opposing sides of thegate stack 106, and each of the multiple layers of semiconductormaterials is surrounded by the gate stack 106.

The S/D features 104 may include epitaxial semiconductor materials withproper n-type or p-type dopants, for example, for applying proper stressand enhancing performance of the device 100. For example, the S/Dfeatures 104 may include silicon and may be doped with carbon,phosphorous, arsenic, other n-type dopant, or combinations thereof (forexample, forming Si:C epitaxial source/drain features, Si:P epitaxialsource/drain features, or Si:C:P epitaxial source/drain features).Alternatively, the S/D features 104 may include silicon germanium orgermanium and may be doped with boron, other p-type dopant, orcombinations thereof (for example, forming Si:Ge:B epitaxialsource/drain features). The S/D features 104 may be formed by etchingthe fins 103 on both sides of the gate stacks 106 to form S/D trenches,and epitaxially growing semiconductor material(s) in the S/D trenchesusing CVD deposition techniques (for example, vapor phase epitaxy),molecular beam epitaxy, other suitable epitaxial growth processes, orcombinations thereof. The S/D features 104 may be grown as asingle-phase epitaxy or a multi-phase epitaxy or may include amorphoussemiconductor material(s). The bottom surface of the S/D features 104may be above the bottom surface of the fin sidewall spacers 107, such asshown in FIG. 2D. Alternatively, the bottom surface of the S/D features104 may be below the bottom surface of the fin sidewall spacers 107.Adjacent S/D features 104 may be separated from each other or may mergetogether in some embodiments.

The isolation structure 105 may include silicon oxide (SiO₂), siliconnitride (Si₃N₄), silicon oxynitride (SiON), fluoride-doped silicateglass (FSG), a low-k dielectric material, and/or other suitableinsulating material. In an embodiment, the isolation structure 105 isformed by etching trenches in or over the substrate 102 (e.g., as partof the process of forming the fins 103), filling the trenches with aninsulating material, and performing a chemical mechanical planarization(CMP) process and/or an etching back process to the insulating material,leaving the remaining insulating material as the isolation structure105. Other types of isolation structure may also be suitable, such asfield oxide and LOCal Oxidation of Silicon (LOCOS). The isolationstructure 105 may include a multi-layer structure, for example, havingone or more liner layers (e.g., silicon nitride) on surfaces of thesubstrate 102 and the fins 103 and a main isolating layer (e.g., silicondioxide) over the one or more liner layers.

Each of the gate stacks 106 includes a multi-layer structure. Forexample, each of the gate stacks 106 may include a dielectricinterfacial layer, a high-k gate dielectric layer over the dielectricinterfacial layer, and a gate electrode layer over the high-k gatedielectric layer. The gate electrode layer may include a work functionlayer and a metal fill layer over the work function layer. The gatestacks 106 may include additional layers such as capping layers andbarrier layers. In various embodiments, the dielectric interfacial layermay include a dielectric material such as silicon oxide (SiO₂) orsilicon oxynitride (SiON), and may be formed by chemical oxidation,thermal oxidation, atomic layer deposition (ALD), chemical vapordeposition (CVD), and/or other suitable methods. The high-k gatedielectric layer may include HfO₂, HfSiO, HfSiO₄, HfSiON, HfLaO, HfTaO,HfTiO, HfZrO, HfAlO_(x), ZrO₂, ZrSiO₂, AlSiO, Al₂O₃, TiO₂, LaO, LaSiO,Ta₂O₃, Ta₂O₅, Y₂O₃, SrTiO₃, BaZrO₃, BaTiO₃ (BTO), (Ba,Sr)TiO₃ (BST),Si₃N₄, hafnium dioxide-alumina (HfO₂—Al₂O₃) alloy, other suitable high-kdielectric material, or combinations thereof. High-k dielectric materialgenerally refers to dielectric materials having a high dielectricconstant, for example, greater than that of silicon oxide (k≈3.9). Thehigh-k gate dielectric layer may be formed by ALD and/or other suitablemethods. The work function layer can be an n-type work function metal ora p-type work function metal. P-type work function layer includes anysuitable p-type work function material, such as TiN, TaN, TaSN, Ru, Mo,Al, WN, WCN ZrSi₂, MoSi₂, TaSi₂, NiSi₂, other p-type work functionmaterial, or combinations thereof. N-type work function layer includesany suitable n-type work function material, such as Ti, Al, Ag, Mn, Zr,TiAl, TiAlC, TiAlSiC, TaC, TaCN, TaSiN, TaAl, TaAlC, TaSiAlC, TiAlN,other n-type work function material, or combinations thereof. The workfunction layer may be deposited by CVD, PVD, and/or other suitableprocess. The metal fill layer may include a metal such as aluminum (Al),tungsten (W), cobalt (Co), copper (Cu), and/or other suitable materials;and may be deposited using plating, CVD, PVD, or other suitableprocesses. The gate stacks 106 may be formed by any suitable processesincluding gate-first processes and gate-last processes. In a gate-firstprocess, various material layers are deposited and patterned to becomethe gate stacks 106 before the S/D features 104 are formed. In agate-last process (also termed as a gate replacement process), temporarygate structures are formed first. Then, after the S/D features 104 areformed, the temporary gate structures are removed and replaced with thegate stacks 106.

Each of the fin sidewall spacers 107 and the gate spacers 108 may be asingle layer or multi-layer structure. In some embodiments, each of thespacers 107 and 108 include a dielectric material, such as silicon oxide(SiO₂), silicon nitride (Si₃N₄), silicon oxynitride (SiON), otherdielectric material, or combination thereof. In an example, the spacers107 and 108 are formed by depositing a first dielectric layer (e.g., aSiO₂ layer having a substantially uniform thickness) as an liner layerover the device 100 including the gate stacks 106 and the fins 103, anda second dielectric layer (e.g., a Si₃N₄ layer) as a main D-shapedspacer over the first dielectric layer, and then, anisotropicallyetching to remove portions of the dielectric layers to form the spacers107 and 108. Additionally, the fin sidewall spacers 107 may be partiallyremoved during the etching process that forms recesses into the fins 103prior to growing the S/D features 104. In some embodiments, the finsidewall spacers 107 may be completely removed by such etching process.

The CESL 110 may include silicon nitride (Si₃N₄), silicon oxynitride(SiON), silicon nitride with oxygen (O) or carbon (C) elements, and/orother materials. The CESL 110 may be formed by plasma enhanced CVD(PECVD) process and/or other suitable deposition or oxidation processes.The CESL 110 covers the outer surfaces of the S/D features 104, thesidewalls of the gate spacers 108, and the top surface of the isolationstructure 105.

The dielectric gate cap 109 includes La₂O₃, Al₂O₃, SiOCN, SiOC, SiCN,SiO₂, SiC, ZnO, ZrN, Zr₂Al₃O₉, TiO₂, TaO₂, ZrO₂, HfO₂, Si₃N₄, Y₂O₃,AlON, TaCN, ZrSi, or other suitable material(s). The dielectric gate cap109 protects the gate stacks 106 from etching and CMP processes that areused for etching S/D contact holes. The dielectric gate cap 109 may beformed by recessing the gate stacks 106; depositing one or moredielectric materials over the recessed gate stacks 106, the gate spacers108, and the CESL 110; and performing a CMP process to the one or moredielectric materials. In the embodiment depicted in FIG. 2C, thedielectric gate cap 109 includes a lower portion extending between twoopposing sidewalls of the gate spacer 108. This lower portion has awidth w1 ranging from 2 nm to 50 nm and a height h1 ranging from 1 nm to50 nm in an embodiment. The dielectric gate cap 109 further includes anupper portion above the gate spacer 108 and the CESL 110. This upperportion may have a height h2 ranging from 1 nm to 30 nm in anembodiment. In some embodiment (not shown), the dielectric gate cap 109has the lower portion but not the upper portion. In other words, thedielectric gate cap 109 is disposed between the two opposing sidewallsof the gate spacer 108 but not above the gate spacer 108. In someembodiment (not shown), the dielectric gate cap 109 has the upperportion but not the lower portion. In other words, the dielectric gatecap 109 is disposed above the gate stack 106, the gate spacer 108, andthe CESL 110, but not disposed between the two opposing sidewalls of thegate spacer 108.

The dielectric layer 112 (also referred to as inter-level dielectric,interlayer dielectric, or ILD layer 112) may include materials such astetraethylorthosilicate (TEOS) oxide, un-doped silicate glass, or dopedsilicon oxide such as borophosphosilicate glass (BPSG), fluoride-dopedsilica glass (FSG), phosphosilicate glass (PSG), boron doped siliconglass (BSG), and/or other suitable dielectric materials. The ILD layer112 may be deposited by a PECVD process, a flowable CVD (FCVD) process,or other suitable deposition technique. In an embodiment, the CESL 110is deposited as a conformal layer over the substrate 102 coveringvarious structures thereon, and the ILD layer 112 is deposited over theCESL 110 to fill trenches between the gate stacks 106. Then, the ILDlayer 112 and the CESL 110 are partially removed during a process offorming the gate stacks 106 (e.g., a replacement gate process) and thegate dielectric cap 109. Thereafter, additional dielectric materials aredeposited over the gate stacks 106 (e.g., a replacement gate process)and the gate dielectric cap 109. These additional dielectric materialsbecome part of the ILD layer 112.

At operation 14, the method 10 (FIG. 1A) etches the ILD layer 112 andthe CESL 110 to form contact holes (or holes) 116. Referring to FIGS. 3Aand 3B, the contact holes 116 expose portions of the S/D features 104.The operation 14 may involve a variety of processes includingdeposition, photolithography, and etching. For example, an etch mask(not shown) may be formed over the device 100, providing openings,through which various portions of the device 100 are exposed. Theopenings correspond to the areas of the device 100 where S/D contactsfor S/D features 104 are to be formed. In various embodiments, the etchmask may include a hard mask layer (e.g., having silicon nitride orsilicon oxide), a photoresist layer, or a combination thereof. The etchmask may be formed by deposition, photolithography, and etchingprocesses. Then, the device 100 is etched through the openings in theetch mask to remove portions of the dielectric layer 112, for example,using a dry etching process, a wet etching process, a reactive ionetching process, or other suitable etching processes to form the holes116. The etching process is tuned selective to the material of thedielectric layer 112, and with no (or minimal) etching to the dielectricgate cap 109 and the CESL 110. Subsequently, another etching process isperformed through the openings in the etch mask to remove portions ofthe CESL 110 at the bottom of the holes 116, for example, using a dryetching process, a wet etching process, or a reactive ion etchingprocess. Particularly, this etching process is anisotropic and is tunedselective to the CESL 110. As a result, portions of the CESL 110 remainover the side surfaces of the gate spacers 108 after the etching processis finished. In various embodiments, the ILD layer 112 and the CESL 110may be etched by one joint etching process or by more than one etchingprocess. Following the etching process, the etch mask is removed, forexample, by stripping or etching. At the end of the operation 14, thecontact holes 116 are formed. Each of the contact holes 116 exposesportions of the S/D feature 104, some side surfaces of the ILD layer112, top and side surfaces of the dielectric gate cap 109, and sidesurfaces of the CESL 110.

At operation 16, the method 10 (FIG. 1A) forms silicide features 128over the exposed portions of the S/D features 104. Referring to FIGS. 4Aand 4B, the silicide features 128 are formed on one or more surfaces ofthe S/D features 104. The edge area (or end area) of the silicidefeatures 128 are adjacent to the CESL 110. In an embodiment, theoperation 16 includes depositing one or more metals into the contactholes 116, performing an annealing process to the device 100 to causereaction between the one or more metals and the S/D features 104 toproduce the silicide features 128, and removing un-reacted portions ofthe one or more metals, leaving the silicide features 128 exposed in thecontact holes 116. The one or more metals may include titanium (Ti),tantalum (Ta), tungsten (W), nickel (Ni), platinum (Pt), ytterbium (Yb),iridium (Ir), erbium (Er), cobalt (Co), or a combination thereof (e.g.,an alloy of two or more metals) and may be deposited using CVD, PVD,ALD, or other suitable methods. The silicide features 128 may includetitanium silicide (TiSi), nickel silicide (NiSi), tungsten silicide(WSi), nickel-platinum silicide (NiPtSi), nickel-platinum-germaniumsilicide (NiPtGeSi), nickel-germanium silicide (NiGeSi), ytterbiumsilicide (YbSi), platinum silicide (PtSi), iridium silicide (IrSi),erbium silicide (ErSi), cobalt silicide (CoSi), or other suitablecompounds.

In some embodiments, the S/D features 104 may be over-etched beforeforming the silicide features 128, an example of which is shown in FIG.12. Referring to FIG. 12, the S/D features 104 are etched (e.g., as partof the operation 14) and their exposed top surfaces become a U-shape inthis cross-sectional view. Particularly, each of the exposed S/Dfeatures 104 has two sidewall S/D sections 104 a directly under the CESL110 and a main S/D section 104 b below the two sidewall S/D sections 104a. To further these embodiments, the silicide features 128 may also havea U-shaped top surface, such as shown in FIG. 13. Referring to FIG. 13,each of the silicide features 128 has two sidewall silicide sections 128a above a main silicide section 128 b. In various embodiments, a widthof the sidewall S/D sections 104 a (along the “x” direction) may be inthe range of about 0.1 nm to 10 nm after the operation 16.Alternatively, the sidewall S/D sections 104 a may be fully converted tothe silicide features 128 during the silicidation process. In someembodiments, the sidewall silicide sections 128 a may have a width ofabout 1 nm to 10 nm and may extend above the main silicide section 128 bby about 0.1 nm to 10 nm. Further, the main silicide section 128 b mayhave a thickness (e.g., along the “z” direction) of about 1 nm to 10 nm.

At operation 18, the method 10 (FIG. 1A) selectively deposits aninhibitor 129 on the device 100. The inhibitor 129 includes an organicor organic-like film that includes amphiphilic or amphiphilic-likemolecules. Referring to FIGS. 5A and 5B, the inhibitor 129 is depositedon the surfaces of the silicide features 128, but not on the dielectriclayers 112, 109, and 110. It is noted that the inhibitor 129 may or maynot touch the CESL 110 in a corner area 127 where the silicide feature128 and the CESL 110 meet. In an embodiment, the inhibitor 129 isdeposited on the surface of the silicide features 128 due to covalentbonds between the molecules of the silicide features 128 and themolecules of the inhibitor 129. Such covalent bonds do not exist betweenthe dielectric surfaces of the layers 112, 109, 110 and the inhibitor129. Thus, the inhibitor 129 is not deposited over these dielectricsurfaces. The inhibitor 129 further has a hydrophobic property such thatit is not attachable to a dielectric material (i.e., it repels thedeposition of a dielectric material thereon), which will be furtherexplained with reference to the operation 20. For example, the inhibitor129 may include a compound of alkyl chain or carboxylic acid in someembodiment or may have a chemical formula of SHCH₂C₆H₄CH₂SH, orHS—(CH₂)_(n)—COOH in some embodiment. The inhibitor 129 may be depositedusing ALD, PVD, CVD, or other suitable methods and may have a thickness(along the “z” direction) of about 1 nm to 30 nm. The thickness of theinhibitor 129 determines the size of a gap between the silicide features128 and a dielectric liner layer (such as the dielectric liner layer132) to be formed in a later step. As will be discussed later, the gapis filled with S/D contact feature(s) (such as the S/D contacts 130) tobe formed in a later step. If the inhibitor 129 is too thin (such asless than 1 nm), then the gap would be too small to be filled by the S/Dcontact feature(s) in some instances. This would inadvertently reducethe S/D contact area. If the inhibitor 129 is too thick (such as morethan 30 nm), then the risk of shorting the S/D contact feature(s) tonearby gates or S/D contact features would increase in some instances.Therefore, the thickness of the inhibitor 129 is controlled to be in therange of about 1 nm to about 30 nm in the present embodiment. In thepresent embodiment, the inhibitor 129 is deposited only on selectedsurfaces (i.e., the surfaces of the silicide feature 128) withoutinvolving a photolithography process. Thus, the operation 18 is aselective deposition process.

At operation 20, the method 10 (FIG. 1A) selectively deposits adielectric liner layer 132 on bottom and sidewalls of the contact holes116 and on the top surface of the ILD layer 112. Referring to FIGS. 6Aand 6B, the dielectric liner layer 132 is deposited to have asubstantially uniform thickness along the various surfaces of the ILDlayer 112, the isolation feature 105, the dielectric gate cap 109, andthe CESL 110. Due to the hydrophobic property of the inhibitor 129, thedielectric liner layer 132 is not deposited on the inhibitor 129 exceptsome edge areas of the inhibitor 129. The dielectric liner layer 132 mayor may not touch the edge areas of the inhibitor 129. In variousembodiment, the dielectric liner layer 132 may include La₂O₃, Al₂O₃,SiOCN, SiOC, SiCN, SiO₂, SiC, ZnO, ZrN, Zr₂Al₃O₉, TiO₂, TaO₂, ZrO₂,HfO₂, Si₃N₄, Y₂O₃, AlON, TaCN, ZrSi, or other suitable material(s). Thedielectric liner layer 132 functions to isolate the adjacent S/Dcontacts that are to be formed in the contact holes 116 (FIG. 6B).Without the dielectric liner layer 132, metals from the S/D contacts maydiffuse into the ILD layer 112 over time to short the S/D contacts,causing circuit failure. The dielectric liner layer 132 also functionsto isolation the S/D contacts from the nearby gate stacks 106. Thedielectric liner layer 132 may be deposited using ALD, CVD, or othersuitable methods, and may have a thickness of about 1 nm to about 30 nm(e.g., as measured on the sidewalls of the CESL 110 along the “x”direction) in various embodiments. In the present embodiment, thedielectric liner layer 132 is deposited only on selected surfaces (i.e.,the surfaces of the ILD layer 112, the isolation feature 105, thedielectric gate cap 109, and the CESL 110) without involving aphotolithography process. Thus, the operation 20 is a selectivedeposition process. Particularly, since the dielectric liner layer 132is not deposited on the inhibitor 129, a vertical etching process forbreaking down the dielectric liner layer 132 is not needed.

At operation 22, the method 10 (FIG. 1A) removes the inhibitor 129 fromthe device 100, particularly from the surfaces of the silicide features128. Referring to FIGS. 7A and 7B, the removal of the inhibitor 129results in gaps (or voids) 133 in the corner areas 127 where thesilicide features 128 and the CESL 110 meet. In the cross-sectional viewof FIG. 7A, the gaps 133 exist directly below the dielectric liner layer132 and above the silicide feature 128 and expose a portion of the sidesurface of the CESL 110. Similarly, in the cross-sectional view of FIG.7B, the gaps 133 exposes the surfaces of the silicide feature 128, thedielectric liner layer 132, and the CESL 110. In an embodiment, theremoval of the inhibitor 129 includes a plasma dry etching process, achemical dry etching process, an ashing process, a wet etching process,or a combination thereof. The etching and ashing processes are selectiveto the materials of the inhibitor 129 and have no (or minimal) etchingto the dielectric liner layer 132, the CESL 110, and the silicidefeatures 128. For example, the plasma dry etching process may useconventional dry etchant for dielectric material such as C₄F₆ mixed withH₂ or O₂, the chemical dry etching process may use one or more chemicalssuch as H₂, the ashing process may use oxygen or hydrogen ashing, andthe wet etching process may apply a hot SPM solution (a mixture ofsulfuric acid and hydrogen peroxide), for example, at a temperate above100° C.

As a result of the operations 18, 20, and 22, various surfaces of thesilicide feature 128 are exposed in each contact hole 116 and thedielectric liner layer 132 is disposed over various surfaces of the ILDlayer 112, the isolation feature 105, the dielectric gate cap 109, andthe CESL 110. In approaches that do not use the inhibitor 129 (i.e.,omitting the operation 18 and 22), the dielectric liner layer 132 wouldbe deposited not only on the surfaces of the layers 112, 109, and 110,but also on the silicide features 128. In order to expose the silicidefeatures 128 for subsequent electrical connection to S/D contacts, anetching process would be performed to etch the dielectric liner layer132. Sometimes, to ensure that the dielectric liner layer 132 iscompletely removed from the surfaces of the silicide features 128, anover-etching would be performed. The over-etching may lead tounnecessary loss of the silicide features 128 and/or the S/D features104. Further, these etching processes sometimes also partially orcompletely remove the dielectric gate cap 109. To compensate for theloss of the dielectric gate cap 109, these approaches would make aninitial gate stack (e.g., dummy gates) tall, which inadvertentlydecreases the robustness of the process because tall and narrow stacksmay collapse during fabrication. In contrast, by using the inhibitor129, processes according to the present embodiment are more robust andhave better control on the volume of the S/D features 104. Further, dueto the presence of the gaps 133, there are more areas of the silicidefeatures 128 for making S/D contacts, thereby reducing S/D contactresistance.

At operation 24, the method 10 (FIG. 1B) deposits one or more metals ormetallic materials 130 into the contact holes 116 and filling thecontact holes 116. Referring to FIGS. 8A and 8B, the one or more metals130 are deposited over the top and side surfaces of the S/D features 104and in direct contact with the silicide feature 128. Particularly, theone or more metals 130 fill the gaps 133. In other words, a portion ofthe one or more metals 130 is in direct contact with a surface of thedielectric liner layer 132, a surface of the CESL 110, and a surface ofthe silicide feature 128. In embodiments, the one or more metals 130 mayinclude tungsten (W), cobalt (Co), copper (Cu), Ruthenium (Ru), othermetals, metal nitrides such as titanium nitride (TiN), titanium aluminumnitride (TiAlN), tungsten nitride (WN), tantalum nitride (TaN), orcombinations thereof, and may be formed by CVD, PVD, plating, and/orother suitable processes. In some embodiments, the one or more metals130 include a layer of metal nitride (e.g., TiN, TiAlN, WN, or TaN) anda layer of metal (e.g., W, Co, or Cu) over the layer of the metalnitride. To further these embodiments, the layer of metal nitride makesdirect contact with the surfaces of the dielectric liner layer 132, theCESL 110, and the silicide feature 128 in the gaps 133. Further, becausethe one or more metals 130 fill the gaps 133, the interfacial areabetween the one or more metals 130 and the silicide feature 128 isincreased, compared to approaches where the gaps 133 do not exist andthe dielectric liner layer 132 directly contacts the silicide feature128. The increased interfacial area reduces the S/D contact resistance.

At operation 26, the method 10 (FIG. 1B) performs a CMP process toplanarize a top surface of the device 100. Referring to FIGS. 9A and 9B,in the present embodiment, the CMP process removes excessive portions ofthe one or more metals 130, the dielectric liner layer 132, and the ILDlayer 112, and stops at the dielectric gate cap 109. The CMP process mayalso partially remove the dielectric gate cap 109 in some embodiments.The remaining portion of the one or more metals becomes the S/D contacts130.

At operation 28, the method 10 (FIG. 1B) recesses the S/D contacts 130and forms a dielectric S/D cap 134 in the recess. Referring to FIGS. 10Aand 10B, the S/D contacts 130 are recessed by one or more etchingprocesses to form a recess (not shown) between two opposing portions ofthe dielectric liner layer 132. The one or more etching processes mayinclude a dry etching, a wet etching, a reactive ion etching, or acombination thereof. Further, the one or more etching processes aretuned to selectively etch the materials of the S/D contacts 130 and haveno (or minimal) etching to the ILD layer 112, the dielectric gate cap109, and the dielectric liner layer 132. After the recess is formed, oneor more dielectric materials are deposited into the recess, which may befollowed by a CMP process to planarize the top surface of the device100. The one or more dielectric materials remaining in the recess becomethe dielectric S/D cap 134. In various embodiment, the dielectric S/Dcap 134 may include La₂O₃, Al₂O₃, SiOCN, SiOC, SiCN, SiO₂, SiC, ZnO,ZrN, Zr₂Al₃O₉, TiO₂, TaO₂, ZrO₂, HfO₂, Si₃N₄, Y₂O₃, AlON, TaCN, ZrSi, orother suitable material(s). The dielectric S/D cap 134 may be depositedusing ALD, CVD, or other suitable methods, and may have a thickness ofabout 2 nm to about 30 nm (e.g., as measured along the “z” direction) invarious embodiments. In some embodiments of the method 10, the operation28 is omitted and the dielectric S/D cap 134 is also omitted in thedevice 100.

The method 10 may perform further steps at the operation 30 to completethe fabrication of the device 100. For example, it may perform variousprocesses to form gate contacts electrically coupled to the gate stacks106 and form metal interconnects connecting the S/D contacts 130 toother portions of the device 100 to form a complete IC. Further,although the embodiments shown in FIGS. 2A-10B include fins 103(therefore applicable to FinFETs), the present disclosure is not solimited, and the disclosed techniques can be applied to planartransistors or other types of multi-gate transistors for reducing S/Dcontact resistance and improving S/D contact isolation in thosetransistors.

FIGS. 11A and 11B illustrate some embodiment of the device 100fabricated according to an embodiment of the method 10. For simplicity,the same reference numerals indicate the same features between theembodiment in FIGS. 10A-10B and the embodiment in FIGS. 11A-11B. FIG.11A further illustrates two variants of the gap 133—gap 133-1 and gap133-2 that are surrounded at three sides by the dielectric liner layer132, the CESL 110, and the silicide feature 128 and are open towards thecenter of the S/D contact 130. In FIGS. 11A and 11B, the gaps 133,133-1, and 133-2 are filled by the S/D contacts 130. As illustrated,each of the two gaps 133-1 and 133-2 becomes narrower as it approachesthe side surface of the CESL 110 (i.e., each of them is wider towardsthe center of the S/D contacts 130 and is narrower towards the CESL110). This may have resulted from the property of the materials in theinhibitor 129 and the dielectric liner layer 132 in the operations 18-20of FIG. 1A. This may have alternatively or additionally resulted fromthe etching process that removes the inhibitor 129 in the operation 22of FIG. 1A. The bottom surface of the dielectric liner layer 132 have arounded profile directly above the gaps 133-1 and 133-2. In someembodiments, the rounding d1 of the bottom surface of the dielectricliner layer 132 (i.e. the vertical distance between the highest point ofthe bottom surface to the lowest point of the bottom surface of thedielectric liner layer 132) is in a range of about 1 nm to 30 nm. Therounded profile makes it easier for the S/D contacts 130 to fill intothe gaps. In various embodiments, a distance d2 between the bottomsurface of the dielectric liner layer 132 and the top surface of thesilicide feature 128 is in a range of about 1 nm to 30 nm. The distanced2 is the height of the gaps 133 (including 133-1 and 133-2). If thedistance d2 is smaller than 1 nm, it will become more difficult for theS/D contacts 130 to fill in the gap, reducing the interfacial areabetween the S/D contact 130 and the silicide feature 128 and increasingS/D contact resistance. If the distance d2 is greater than 30 nm, thenthere may be areas on the ILD layer 112 that are not sufficientlycovered by the dielectric liner 132 (for example, in the view shown inFIG. 11B), leading to metal diffusion from the S/D contacts 130 into theILD layer 112. Therefore, having the distance d2 in the range of 1 nm to30 nm achieves a good balance between reducing S/D contact resistanceand improving S/D contact isolation. Further, the two gaps 133-1 and133-2 may have the same distance d2 or they may have different distancesd2 (i.e., their height may have the same or different values). Referringto FIG. 11B, the portion of the dielectric liner layer 132 on the topsurface of the isolation feature 105 has a thickness t1 of about 1 nm to30 nm. In approaches that do not utilize the inhibitor 129, this portionof the dielectric liner layer 132 generally does not exist (or isremoved before depositing the metals for the S/D contacts 130). Havingthis portion of the dielectric liner layer 132 increases the isolationbetween the S/D contacts 130 and the isolation feature 105. Further, theportion of the dielectric liner layer 132 on the sidewalls of thecontact hole (or on the sidewalls of the ILD layer 112 facing thecontact hole) may overlap with the silicide feature 128 by a thicknesst2 along the sloped surface of the silicide feature 128. In variousembodiments, the thickness t2 is in a range of about −10 nm (i.e., thedielectric liner layer 132 and the silicide feature 128 have no overlapand are spaced away by up to 10 nm along the sloped surface of thesilicide feature 128) to 10 nm (i.e., the dielectric liner layer 132 andthe silicide feature 128 have an overlap up to 10 nm along the slopedsurface of the silicide feature 128).

Although not intended to be limiting, one or more embodiments of thepresent disclosure provide many benefits to a semiconductor device and aformation process thereof. For example, embodiments of the presentdisclosure provide a process for depositing a dielectric liner layer onsidewalls of a contact hole but not on the bottom of the contact hole.This is achieved by depositing a dielectric-inhibitor on the bottom ofthe contact hole prior to the deposition of the dielectric liner layerand removing the dielectric-inhibitor after the deposition of thedielectric liner layer. This process avoids vertical etching of thedielectric liner layer and increases process robustness while achievinggood S/D contact isolation and reducing S/D contact resistance. Further,the provided subject matter can be readily integrated into existing ICfabrication flow and can be applied to many different process nodes.

In one example aspect, the present disclosure is directed to a method.The method includes providing a structure that includes a substrate; agate structure over the substrate; a gate spacer on a sidewall of thegate structure; a dielectric gate cap over a top surface of the gatestructure; a source/drain (S/D) feature over the substrate and adjacentto the gate structure; a contact etch stop layer (CESL) covering asidewall of the gate spacer and a top surface of the S/D feature; and aninter-level dielectric (ILD) layer over the dielectric gate cap, thegate spacer, the CESL, and the S/D feature. The method further includesetching a contact hole through the ILD layer and through a portion ofthe CESL that is disposed over the S/D feature, wherein the contact holeexposes the CESL covering the sidewalls of the gate spacer and exposes atop portion of the S/D feature. The method further includes forming asilicide feature on the top portion of the S/D feature and selectivelydepositing an inhibitor on the silicide feature, wherein the inhibitoris not deposited on surfaces of the CESL other than at a corner areawhere the CESL and the silicide feature meet.

In an embodiment of the method, the inhibitor includes an organic filmhaving amphiphilic molecules. In an embodiment, the method furtherincludes selectively depositing a dielectric liner layer covering asidewall of the CESL, wherein the dielectric liner layer is notdeposited on the inhibitor other than an edge area of the inhibitor. Ina further embodiment, the dielectric liner layer includes at least oneof La₂O₃, Al₂O₃, SiOCN, SiOC, SiCN, SiO₂, SiC, ZnO, ZrN, Zr₂Al₃O₉, TiO₂,TaO₂, ZrO₂, HfO₂, Si₃N₄, Y₂O₃, AlON, TaCN, or ZrSi. In another furtherembodiment, the method includes removing the inhibitor; depositing oneor more metallic materials into the contact hole; and performing achemical-mechanical planarization process to the one or more metallicmaterials. In some embodiments, the removing of the inhibitor includesplasma dry etching, chemical dry etching, ashing, wet etching, or acombination thereof. In some alternative embodiments, the removing ofthe inhibitor includes a wet etching with SPM cleaning solution at atemperature over 100° C. In some embodiments, the removing of theinhibitor results in a gap that exposes a sidewall surface of the CESL,a bottom surface of the dielectric liner layer, and a top surface of thesilicide feature. In further embodiments, the one or more metallicmaterials fill the gap.

In another example aspect, the present disclosure is directed to amethod. The method includes providing a structure that includes asubstrate; an isolation structure over the substrate; a fin extendingfrom the substrate; an epitaxial source/drain (S/D) feature on the fin;a contact etch stop layer (CESL) covering a top surface of the isolationstructure and surfaces of the S/D feature; and an inter-level dielectric(ILD) layer over the CESL. The method further includes etching a contacthole over the S/D feature, wherein the contact hole penetrates throughthe ILD layer and the CESL and exposes the S/D feature; forming asilicide feature on the S/D feature that is exposed in the contact hole;selectively depositing an inhibitor on the silicide feature, wherein theinhibitor is not deposited on surfaces of the ILD layer and the CESL;selectively depositing a dielectric liner layer on sidewalls and topsurfaces of the contact hole, wherein the dielectric liner layer is notdeposited on the inhibitor; and removing the inhibitor to expose thesilicide feature in the contact hole.

In some embodiments, after the removing of the inhibitor, the methodfurther includes depositing one or more metallic layers into the contacthole and performing a chemical-mechanical planarization (CMP) process tothe one or more metallic layers. In some embodiments, after theperforming of the CMP process, the method further includes recessing theone or more metallic layers and after the recessing, depositing adielectric cap on the one or more metallic layers. In a furtherembodiment, the dielectric cap includes La₂O₃, Al₂O₃, SiOCN, SiOC, SiCN,SiO₂, SiC, ZnO, ZrN, Zr₂Al₃O₉, TiO₂, TaO₂, ZrO₂, HfO₂, Si₃N₄, Y₂O₃,AlON, TaCN, or ZrSi.

In some embodiments of the method, the inhibitor includes an organicfilm having amphiphilic molecules and the dielectric liner layerincludes La₂O₃, Al₂O₃, SiOCN, SiOC, SiCN, SiO₂, SiC, ZnO, ZrN, Zr₂Al₃O₉,TiO₂, TaO₂, ZrO₂, HfO₂, Si₃N₄, Y₂O₃, AlON, TaCN, or ZrSi. In furtherembodiments, the CESL includes silicon nitride, silicon carbonitride,silicon oxycarbide, silicon carbide, or silicon oxy-carbonitride and theILD layer includes silicon dioxide.

In yet another example aspect, the present disclosure is directed to adevice that includes a substrate; a gate structure over the substrate;gate spacers on sidewalls of the gate structure; a contact etch stoplayer (CESL) on sidewalls of the gate spacers; a dielectric cap over thegate structure; a source/drain (S/D) feature adjacent to the gatespacers; a silicide feature on the S/D feature; a dielectric liner onsidewalls of the CESL, wherein a bottom surface of the dielectric lineris spaced away from the silicide feature by a gap; and a S/D contactover the silicide feature and filling the gap.

In an embodiment of the device, the gap narrows as it approaches theCESL. In an embodiment, a height of the gap is in a range of 1 nm to 30nm. In an embodiment, the S/D contact directly contacts a side surfaceof the CESL and the bottom surface of the dielectric liner. In someembodiments, the device further includes another dielectric cap directlyover the S/D contact and on a sidewall of the dielectric liner.

The foregoing outlines features of several embodiments so that those ofordinary skill in the art may better understand the aspects of thepresent disclosure. Those of ordinary skill in the art should appreciatethat they may readily use the present disclosure as a basis fordesigning or modifying other processes and structures for carrying outthe same purposes and/or achieving the same advantages of theembodiments introduced herein. Those of ordinary skill in the art shouldalso realize that such equivalent constructions do not depart from thespirit and scope of the present disclosure, and that they may makevarious changes, substitutions, and alterations herein without departingfrom the spirit and scope of the present disclosure.

What is claimed is:
 1. A method, comprising: providing a structure thatincludes: a substrate; a gate structure over the substrate; a gatespacer on a sidewall of the gate structure; a dielectric gate cap over atop surface of the gate structure; a source/drain (S/D) feature over thesubstrate and adjacent to the gate structure; a contact etch stop layer(CESL) covering a sidewall of the gate spacer and a top surface of theS/D feature; and an inter-level dielectric (ILD) layer over thedielectric gate cap, the gate spacer, the CESL, and the S/D feature;etching a contact hole through the ILD layer and through a portion ofthe CESL that is disposed over the S/D feature, wherein the contact holeexposes the CESL covering the sidewall of the gate spacer and exposes atop portion of the S/D feature; forming a silicide feature on the topportion of the S/D feature; and selectively depositing an inhibitor onthe silicide feature, wherein the inhibitor is not deposited on surfacesof the CESL other than at a corner area where the CESL and the silicidefeature meet.
 2. The method of claim 1, wherein the inhibitor includesan organic film having amphiphilic molecules.
 3. The method of claim 1,further comprising: selectively depositing a dielectric liner layercovering a sidewall of the CESL, wherein the dielectric liner layer isnot deposited on the inhibitor other than an edge area of the inhibitor.4. The method of claim 3, wherein the dielectric liner layer includes atleast one of La₂O₃, Al₂O₃, SiOCN, SiOC, SiCN, SiO₂, SiC, ZnO, ZrN,Zr₂Al₃O₉, TiO₂, TaO₂, ZrO₂, HfO₂, Si₃N₄, Y₂O₃, AlON, TaCN, or ZrSi. 5.The method of claim 3, further comprising: removing the inhibitor;depositing one or more metallic materials into the contact hole; andperforming a chemical-mechanical planarization process to the one ormore metallic materials.
 6. The method of claim 5, wherein the removingof the inhibitor includes plasma dry etching, chemical dry etching,ashing, wet etching, or a combination thereof.
 7. The method of claim 5,wherein the removing of the inhibitor includes a wet etching with SPMcleaning solution at a temperature over 100° C.
 8. The method of claim5, wherein the removing of the inhibitor results in a gap that exposes asidewall surface of the CESL, a bottom surface of the dielectric linerlayer, and a top surface of the silicide feature.
 9. The method of claim8, wherein the one or more metallic materials fill the gap.
 10. Amethod, comprising: providing a structure that includes: a substrate; anisolation structure over the substrate; a fin extending from thesubstrate; an epitaxial source/drain (S/D) feature on the fin; a contactetch stop layer (CESL) covering a top surface of the isolation structureand surfaces of the S/D feature; and an inter-level dielectric (ILD)layer over the CESL; etching a contact hole over the S/D feature,wherein the contact hole penetrates through the ILD layer and the CESLand exposes the S/D feature; forming a silicide feature on the S/Dfeature that is exposed in the contact hole; selectively depositing aninhibitor on the silicide feature, wherein the inhibitor is notdeposited on surfaces of the ILD layer and the CESL; selectivelydepositing a dielectric liner layer on sidewalls and top surfaces of thecontact hole, wherein the dielectric liner layer is not deposited on theinhibitor; and removing the inhibitor to expose the silicide feature inthe contact hole.
 11. The method of claim 10, after the removing of theinhibitor, further comprising: depositing one or more metallic layersinto the contact hole; and performing a chemical-mechanicalplanarization (CMP) process to the one or more metallic layers.
 12. Themethod of claim 11, after the performing of the CMP process, furthercomprising: recessing the one or more metallic layers; and after therecessing, depositing a dielectric cap on the one or more metalliclayers.
 13. The method of claim 12, wherein the dielectric cap includesLa₂O₃, Al₂O₃, SiOCN, SiOC, SiCN, SiO₂, SiC, ZnO, ZrN, Zr₂Al₃O₉, TiO₂,TaO₂, ZrO₂, HfO₂, Si₃N₄, Y₂O₃, AlON, TaCN, or ZrSi.
 14. The method ofclaim 10, wherein the inhibitor includes an organic film havingamphiphilic molecules and the dielectric liner layer includes La₂O₃,Al₂O₃, SiOCN, SiOC, SiCN, SiO₂, SiC, ZnO, ZrN, Zr₂Al₃O₉, TiO₂, TaO₂,ZrO₂, HfO₂, Si₃N₄, Y₂O₃, AlON, TaCN, or ZrSi.
 15. The method of claim14, wherein the CESL includes silicon nitride, silicon carbonitride,silicon oxycarbide, silicon carbide, or silicon oxy-carbonitride and theILD layer includes silicon dioxide.
 16. A method, comprising: providinga structure that includes: a substrate; an epitaxial source/drain (S/D)feature over the substrate; a contact etch stop layer (CESL) over theS/D feature; and an inter-level dielectric (ILD) layer over the CESL;etching a contact hole through the ILD layer and the CESL, therebyexposing the S/D feature; forming a silicide feature on the S/D featurethat is exposed in the contact hole; selectively depositing an inhibitoron the silicide feature and not on surfaces of the ILD layer and theCESL; selectively depositing a dielectric liner layer on surfaces of theILD layer and the CESL and not on the inhibitor; selectively removingthe inhibitor to expose the silicide feature in the contact hole,resulting a gap between the dielectric liner layer and the silicidefeature; and depositing one or more metallic layers into the contacthole and filling the gap.
 17. The method of claim 16, wherein theetching of the contact hole also etches a recess into the S/D feature,and wherein the silicide feature partially fills the recess.
 18. Themethod of claim 16, wherein the inhibitor includes an organic filmhaving amphiphilic molecules and the dielectric liner layer includes oneof La₂O₃, Al₂O₃, SiOCN, SiOC, SiCN, SiO₂, SiC, ZnO, ZrN, Zr₂Al₃O₉, TiO₂,TaO₂, ZrO₂, HfO₂, Si₃N₄, Y₂O₃, AlON, TaCN, and ZrSi.
 19. The method ofclaim 16, further comprising: recessing the one or more metallic layers;and after the recessing, depositing a dielectric cap on the one or moremetallic layers.
 20. The method of claim 16, wherein the selectivelyremoving of the inhibitor includes plasma dry etching, chemical dryetching, ashing, wet etching, or a combination thereof.